| Standard No.: | GB/T 17473.7-1998 |
| Chinese Name: | 厚膜微电子技术用贵金属浆料测试方法 可焊性、耐焊性试验 |
| English Name: | Test methods of precious metal pastes used for thick film microelectronics--Test of solderability and solderleaching resistance |
| Professional Classification: | H23 Metal processing property test method |
| Professional Classification: | GB National Standard |
| ICS Classification: |
77.040.01 Testing of metals in general
|
| Issued by: | |
| Issued on: | 1998-08-19 |
| Implemented on: | 1999-03-01 |
| Status: |
ABOLISHED |
| Replace By: | GB/T17473.7-2008 Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance
|
| Replace By Date: | 2008-09-01 |
| Language: | English |
| File Format: | PDF |
| Word Count: | |
| Price(USD): | please email coc@codeofchina.com for quotation
|
| Delivery: | via email in
1-3 business day
|
