Standard No.:	GB/T 8446.2-2004
Chinese Name:	电力半导体器件用散热器 第2部分：热阻和流阻测试方法
English Name:	Heat sink for power semiconductor device—Part 2:Measuring method of thermal resistance and imput fluid-output fluid pressure difference
Professional Classification:	K46 Power semiconductor device and parts
Professional Classification:	GB National Standard
ICS Classification:	31.080
Issued by:
Issued on:	2004-02-04
Implemented on:	2004-08-01
Status:	VALID
Language:	English
File Format:	PDF
Word Count:
Price(USD):	please email coc@codeofchina.com for quotation
Delivery:	via email in 1-3 business day

1 Scope


This part of GB/T 8446 gives the principles for measuring the thermal resistance and flow resistance of heat sink and specifies the testing system requirements, testing conditions and basic measurement procedures for air-cooling, self-cooling and water-cooling heat sinks.
This part is applicable to the testing of thermal resistance and flow resistance for the cast (including extruded) heat sinks, profile heat sinks and heat tube heat sinks for power semiconductor device.

2 Principles and Heating Current

2.1 Principles

The thermal resistance of heat sink is a measure of the heat sink's capability for dissipating the heat from the tube core of semiconductor device. Its value is defined as: in thermal balance, the ratio of the temperature difference between the specified point on the heat sink worktop and the specified point of cooling medium to the dissipation power for such temperature difference between the two points, see Formula (1).