Gold wire for semiconductor devices lead bonding

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GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
Standard No.:	GB/T 8750-1997	Status:	ABOLISHED remind me the status change Email:
Language:	English	File Format:	PDF
Word Count:		Price(USD):	please email coc@codeofchina.com for quotation remind me the price change Email:
Implemented on:	1998-08-01	Delivery:	via email in 1-3 business day
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Standard No.:	GB/T 8750-1997
Chinese Name:	半导体器件键合金丝
English Name:	Gold wire for semiconductor devices lead bonding
Professional Classification:	H68 Precious metals and their alloys
Professional Classification:	GB National Standard
Issued by:
Issued on:	1997-01-02
Implemented on:	1998-08-01
Status:	ABOLISHED
Replace:	GB8750-1988
Replace By:	GB/T8750-2007 Gold bonding wire for semiconductor devices
Replace By Date:	2008-06-01
Language:	English
File Format:	PDF
Word Count:
Price(USD):	please email coc@codeofchina.com for quotation
Delivery:	via email in 1-3 business day

GB/T 8750-1997 The following standards are cited：

GB/T 8750-1997 Cited by the following standards：

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