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GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
Standard No.: GB/T 8750-1997 Status: ABOLISHED remind me the status change
Language: English File Format: PDF
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Implemented on: 1998-08-01 Delivery: via email in 1-3 business day
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Standard No.: GB/T 8750-1997
Chinese Name: 半导体器件键合金丝
English Name: Gold wire for semiconductor devices lead bonding
Professional Classification: H68 Precious metals and their alloys
Professional Classification: GB National Standard
Issued by:
Issued on: 1997-01-02
Implemented on: 1998-08-01
Status: ABOLISHED
Replace:GB8750-1988
Replace By:GB/T8750-2007 Gold bonding wire for semiconductor devices
Replace By Date:2008-06-01
Language: English
File Format: PDF
Word Count:
Price(USD): please email coc@codeofchina.com for quotation
Delivery: via email in 1-3 business day
GB/T 8750-1997 The following standards are cited:
GB/T 8750-1997 Cited by the following standards:
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