Methods of analysis for silver-copper brazing for electronic devices-Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb (spectrochemical method)

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SJ/T 11021-1996 Methods of analysis for silver-copper brazing for electronic devices-Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb (spectrochemical method)
Standard No.:	SJ/T 11021-1996	Status:	VALID remind me the status change Email:
Language:	English	File Format:	PDF
Word Count:	20500 words	Price(USD):	615 (USD) remind me the price change Email:
Implemented on:	1997-01-01	Delivery:	via email in 1-5 business day
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Standard No.:	SJ/T 11021-1996
Chinese Name:	电子器件用银铜钎焊料的分析方法铅、铋、锌、镉、铁、镁、铝、锡和锑的化学光谱测定
English Name:	Methods of analysis for silver-copper brazing for electronic devices-Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb (spectrochemical method)
Professional Classification:	A01 Technical Management
Professional Classification:	SJ Professional Standard - Electronics
Issued by:
Issued on:	1996-11-20
Implemented on:	1997-01-01
Status:	VALID
Language:	English
File Format:	PDF
Word Count:	20500 words
Price(USD):	615 (USD)
Delivery:	via email in 1-5 business day

SJ/T 11021-1996 The following standards are cited：

SJ/T 11021-1996 Cited by the following standards：

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