Methods of analysis for gold-copper and gold-nickel brazing for electronic devices-Determination of lead (spectrophotometric dithizone method)

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SJ/T 11030-1996 Methods of analysis for gold-copper and gold-nickel brazing for electronic devices-Determination of lead (spectrophotometric dithizone method)
Standard No.:	SJ/T 11030-1996	Status:	ABOLISHED remind me the status change Email:
Language:	English	File Format:	PDF
Word Count:	1500 words	Price(USD):	184 (USD) remind me the price change Email:
Implemented on:	1997-01-01	Delivery:	via email in 1 business day
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Standard No.:	SJ/T 11030-1996
Chinese Name:	电子器件用金铜及金镍钎焊料的分析方法双硫腙分光光度法测定铅
English Name:	Methods of analysis for gold-copper and gold-nickel brazing for electronic devices-Determination of lead (spectrophotometric dithizone method)
Professional Classification:	A01 Technical Management
Professional Classification:	SJ Professional Standard - Electronics
Issued by:	MIIT
Issued on:	1996-11-20
Implemented on:	1997-01-01
Status:	ABOLISHED
Replace:	GB 9621.3-1988
Replace By:	SJ/T 11030-2015
Replace By Date:
Language:	English
File Format:	PDF
Word Count:	1500 words
Price(USD):	184 (USD)
Delivery:	via email in 1 business day

SJ/T 11030-1996 The following standards are cited：

SJ/T 11030-1996 Cited by the following standards：

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