Environmental testing - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices

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SJ/T 11200-1999 Environmental testing - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices
Standard No.:	SJ/T 11200-1999	Status:	ABOLISHED remind me the status change Email:
Language:	English	File Format:	PDF
Word Count:	5500 words	Price(USD):	165 (USD) remind me the price change Email:
Implemented on:	1999-05-01	Delivery:	via email in 1 business day
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Standard No.:	SJ/T 11200-1999
Chinese Name:	环境试验第2部分：试验方法试验Tｄ：表面组装元器件的可焊性、金属化层耐熔蚀性和耐焊接热
English Name:	Environmental testing - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices
Professional Classification:	L04 Basic standards and general methods
Professional Classification:	SJ Professional Standard - Electronics
Issued by:	MIIT
Issued on:	1999-02-02
Implemented on:	1999-05-01
Status:	ABOLISHED
Replace By:	SJ/T 11200-2016
Replace By Date:
Language:	English
File Format:	PDF
Word Count:	5500 words
Price(USD):	165 (USD)
Delivery:	via email in 1 business day

SJ/T 11200-1999 The following standards are cited：

SJ/T 11200-1999 Cited by the following standards：

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