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YS/T 819-2012 High-purity sputtering copper target used in electronic film
Standard No.:
YS/T 819-2012
Status:
VALID
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Email:
OK
Target Language:
English
File Format:
PDF
Word Count:
6000 words
Translation Price:
180 (USD)
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Email:
OK
Implemented on:
2013-03-01
Delivery:
via email in 1-3 business day
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Detail
Introduction
Contents
Standard No.:
YS/T 819-2012
Chinese Name:
电子薄膜用高纯铜溅射靶材
English Name:
High-purity sputtering copper target used in electronic film
Professional Classification:
H62 Heavy metals and their alloys
ICS Classification:
77.150.30 Copper products
Issued by:
Issued on:
2012-11-07
Implemented on:
2013-03-01
Status:
VALID
Target Language:
English
File Format:
PDF
Word Count:
6000 words
Translation Price:
180 (USD)
Delivery:
via email in 1-3 business day
下列文件对于本文件的应用是必不可少的。凡是注日期的引用文件,仅注日期的版本适用于本文件。凡是不注日期的引用文件,其最新版本(包括所有的修改单)适用于本文件。
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YS/T 819-2012 The following standards are cited:
YS/T 819-2012 Cited by the following standards:
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