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HB/Z 5095.3-2004 Methods for analysis of cyaniding plating brass solutions -- Part 3: Determination of sodium carbonate content by potentiometric titrimetric method (USD) via email in 1 business day VALID
HB/Z 5089.1-2004 Methods for analysis of plating black nickel solutions (USD) via email in 1 business day VALID
HB/Z 5089.3-2004 Methods for analysis of plating black nickel solutions-Part 3:Continual determination of nickel sulfate and zinc sulfate content by EDTA compleximetric method (USD) via email in 1 business day ABOLISHED
HB/Z 5095.1-2004 Methods for analysis of cyaniding plating brass solutions -- Part 1: Continual determination of copper (II) cyanate and zinc oxide content by EDTA volumetric method (USD) via email in 1 business day VALID
HB/Z 5087.5-2004 Methods for analysis of acid plating copper solutions part 5:Determination of nickel sulfate content by atomic absorption spectrometric method (USD) via email in 1 business day VALID
HB/Z 5094.1-2004 Methods for analysis of acid plating tin solutions -- Part 1: Determination of tin (II) sulfate content by potentiometric titrimetric method (USD) via email in 1 business day VALID
HB/Z 5087.3-2004 Methods for analysis of acid plating copper solutions part 3:Determination of sulphuric acid content by potentiometric titrimetric method (USD) via email in 1 business day VALID
HB/Z 5094.2-2004 Methods for analysis of acid plating tin solutions -- Part 2: Determination of free sulphuric acid content by potentiometric titrimetric method (USD) via email in 1 business day VALID
HB/Z 5087.7-2004 Methods for analysis of acid plating copper solutions part 7:Determination of antimony content by atomic absorption spectrometric method (USD) via email in 1 business day VALID
HB/Z 5094.3-2004 Methods for analysis of acid plating tin solutions -- Part 3: Determination of lead content by atomic absorption spectrometric method (USD) via email in 1 business day VALID
HB/Z 5096.2-2004 Methods for analysis of plating lead solutions -- Part 2: Determination of free fluorboric acid content by potentiometric titrimetric method (USD) via email in 1 business day VALID
HB/Z 5087.2-2004 Methods for analysis of acid plating copper solutions part 2:Determination of copper sulfate content by potentiometric titrimetric method (USD) via email in 1 business day VALID
HB/Z 5087.4-2004 Methods for analysis of acid plating copper solutions part 4:Determination of iron content by atomic absorption spectrometric method (USD) via email in 1 business day VALID
HB/Z 5094.4-2004 Methods for analysis of acid plating tin solutions -- Part 4: Determination of copper content by atomic absorption spectrometric method (USD) via email in 1 business day VALID
HB/Z 5087.1-2004 Methods for analysis of acid plating copper solutions (USD) via email in 1 business day VALID
HB/Z 5087.6-2004 Methods for analysis of acid plating copper solutions part 6:Determination of arsenic content by spectrophotometric method (USD) via email in 1 business day VALID
HB 5054-1977 Quality Inspection for Rhodium Coating (USD) via email in 1 business day VALID
HB/Z 5093.1-2000 Analysis Method for Alkaline Electrotinning Solution - Determination of Sodium Stannate Content with EDTA Volumetric Method (USD) via email in 1 business day VALID
HB/Z 5093.7-2000 Analysis Method for Alkaline Electrotinning Solution - Determination of Copper Content with Atomic Absorption Spectrometry Method (USD) via email in 1 business day VALID
HB/Z 5099.4-2000 Analysis Method for Silver Plating Solution Determination of Potassium Carbonate Content in Hard Silver Solution Through Potentiometric Titration (USD) via email in 1 business day VALID
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