| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| SJ 20938-2005 |
Microwave circuits -- Measuring methods for frequency converters |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 20521-2006 |
Semconductor devices Part 14-1: Semiconductor sensors - General and classification |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 4589.1-2006 |
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 4937.15-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.17-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| SJ 20961-2006 |
General principles of measuring methods of A/D and D/A converters for integrated circuits |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 20516-2006 |
Semiconductor devices - Discrete devices - Part 4: Microwave devices |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ/T 10229-1991 |
Graphic instrument for characteristics of semiconductor tubes for Type XJ4810 |
 (USD) |
via email in
1 business day
|
VALID
|
|
| GB/T 20522-2006 |
Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| DB52/T 1104-2016 |
Junction-to-case thermal resistance transient test method of semiconductor devices |
|
via email in
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 11499-2001 |
Letter symbols for discrete semiconductor devices |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 4937.201-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling,packing,labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 4937.20-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 17573-1998 |
Semiconductor devices Discrete devices and integrated circuits Part 1:General |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
|
|
