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GB/T 20296-2012 Mnemonics and symbols for integrated circuits 480 (USD) via email in 1-5 business day VALID
GB/T 35010.1-2018 Semiconductor die products—Part 1:Requirements for procurement and use 600 (USD) via email in 1-5 business day VALID
GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation 180 (USD) via email in 1-3 business day VALID
GB/T 28276-2012 Silicon-based MEMS fabrication technology—Specification for dissolved wafer process 240 (USD) via email in 1-3 business day VALID
GB 12199-1990 Basic environmental testing procedures for nonbroadcasting video cassette tape recorders via email in ABOLISHED please email coc@codeofchina.com for quotation
GB/T 15878-1995 Specification of leadframes for small outline package via email in 1-3 business day ABOLISHED please email coc@codeofchina.com for quotation
GB/T 32817-2016 Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 360 (USD) via email in 1-3 business day VALID
GB/T 35010.4-2018 Semiconductor die products—Part 4:Requirements for die users and suppliers 300 (USD) via email in 1-3 business day VALID
SJ 20802-2001 Visual inspection criteria for integrated circuits metal packages 300 (USD) via email in 1-3 business day VALID
GB/T 15877-1995 Specification of DIP leadframes produced by etching via email in 1-3 business day ABOLISHED please email coc@codeofchina.com for quotation
GB/T 33929-2017 Test methods of the performance for MEMS high g accelerometer 240 (USD) via email in 1-3 business day VALID
GB/T 16526-1996 The method measuring the lead-to-lead and loading capacitance of package leads via email in 1-3 business day VALID please email coc@codeofchina.com for quotation
GB/T 15431-1995 Generic specification for microcircuit modules via email in 1-3 business day ABOLISHED please email coc@codeofchina.com for quotation
GB/T 14028-1992 General principles of measuring methods of analogue switches for semiconductor integrated circuits via email in 1-3 business day ABOLISHED please email coc@codeofchina.com for quotation
GB/T 35010.6-2018 Semiconductor die products—Part 6:Requirements for concerning thermal simulation 120 (USD) via email in 1-3 business day VALID
GB/T 8976-1996 Generic specification for film integrated circuits and hybrid film integrated circuits via email in 1-3 business day VALID please email coc@codeofchina.com for quotation
GB/T 28277-2012 Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area 360 (USD) via email in 1-3 business day VALID
GB 8976-1988 via email in ABOLISHED please email coc@codeofchina.com for quotation
GB/T 14029-1992 General principles of measuring methods of analogue multiplier for semiconductor integrated circuits via email in 1-3 business day VALID please email coc@codeofchina.com for quotation
GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits 600 (USD) via email in 1-5 business day VALID
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