| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| GB/T 20296-2012 |
Mnemonics and symbols for integrated circuits |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 35010.1-2018 |
Semiconductor die products—Part 1:Requirements for procurement and use |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 35010.5-2018 |
Semiconductor die products—Part 5:Requirements for concerning electrical simulation |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 28276-2012 |
Silicon-based MEMS fabrication technology—Specification for dissolved wafer process |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB 12199-1990 |
Basic environmental testing procedures for nonbroadcasting video cassette tape recorders |
|
via email in
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 15878-1995 |
Specification of leadframes for small outline package |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 32817-2016 |
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 35010.4-2018 |
Semiconductor die products—Part 4:Requirements for die users and suppliers |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| SJ 20802-2001 |
Visual inspection criteria for integrated circuits metal packages |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 15877-1995 |
Specification of DIP leadframes produced by etching |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 33929-2017 |
Test methods of the performance for MEMS high g accelerometer |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 16526-1996 |
The method measuring the lead-to-lead and loading capacitance of package leads |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 15431-1995 |
Generic specification for microcircuit modules |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 14028-1992 |
General principles of measuring methods of analogue switches for semiconductor integrated circuits |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 35010.6-2018 |
Semiconductor die products—Part 6:Requirements for concerning thermal simulation |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 8976-1996 |
Generic specification for film integrated circuits and hybrid film integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 28277-2012 |
Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB 8976-1988 |
|
|
via email in
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 14029-1992 |
General principles of measuring methods of analogue multiplier for semiconductor integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
|
|
