| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| SJ 21331-2018 |
Ceramic packages and metal packages Technical requirements for the heat treatment of the metal parts process |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21387-2018 |
Multilayer co-fired ceramic-Technical requirements for green bar thermal cutting process |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21352-2018 |
Process technological requirements for the cerium doped inorganic oxide scintillation crystal growths |
135 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21386-2018 |
Multilayer co-fired ceramic-Technical requirements for green sheet via forming process |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21391-2018 |
Multi-layer co-fired ceramic-Technical requirements for green sheet film process |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21385-2018 |
Multilayer co-fired ceramic-Technical requirements for green sheet framing process |
105 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21353-2018 |
Process technological requirements for the cerium doped inorganic oxide scintillation crystals |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21351-2018 |
Process technological rquirements for raw material preparation of the cerium doped inorganic oxide scintillation crystals |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21277-2018 |
Technical requirements for semi-aqueous cleaning technology of microwave assembly |
135 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21477-2018 |
Technical requirements for InP poly crystal synthesis process |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21363-2018 |
General requirements of three-dimensional process planning check and change for electronic equipment |
135 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21437-2018 |
Requirements of three-dimensional model check for military electronic equipment |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21381-2018 |
Test method for time dependent dielectric breakdown (TDDB) |
330 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21318-2018 |
General specification for vacuum high-temperature ovens |
225 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21342-2018 |
|
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21248-2018 |
Technological verification procedures for vacuum soldering equipment |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21359-2018 |
Model based definition representation of welding process information for electronic equipment |
120 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21444-2018 |
Specification for gallium oxide monocrystalline wafers of β-Ga203-N |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ/T 11739-2019 |
|
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ/T 11744-2019 |
|
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
|
|
