| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| QJ 2661-1994 |
Screening Technical Conditions for Silicon-Bridge Rectifier |
 (USD) |
via email in
1 business day
|
VALID
|
|
| GB/T 4937.4-2012 |
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
 (USD) |
via email in
1 business day
|
VALID
|
|
| GB/T 4937.18-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 249-2017 |
The rule of type designation for discrete semiconductor devices |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 29332-2012 |
Semiconductor devices—Discrete devices—Part 9:Insulated-gate bipolar transistors (IGBT) |
|
via email in
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 4937.11-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.13-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.30-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.19-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.22-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 20870.1-2007 |
Semiconductor devices-Part 16-1:Microwave integrated circuits-Amplifiers |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 12560-1999 |
Semiconductor devices --Sectional specification for discrete devices |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 4937.14-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| JB/T 11050-2010 |
AC solid-state relays |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| JB/T 10097-2000 |
Case for power semiconductor device |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| T/IAWBS 004-2017 |
|
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| JB/T 9684-2000 |
Selecting guide of heat sink for power semiconductor device |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.21-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4937.12-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 12:Vibration,variable frequency |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| JB/T 10096-2000 |
Selection guidance of case for power semiconductor device |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
|
|
