| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| GB/T 35010.8-2018 |
Semiconductor die products—Part 8:EXPRESS model schema for data exchange |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 38762.3-2020 |
Geometrical product specifications(GPS)—Dimensional tolerancing—Part 3:Angular sizes |
 (USD) |
via email in
1-3 business day
|
TO BE VALID
|
|
| SJ/T 10805-2000 |
Semiconductor integrated circuits - General principles of measuring methods for voltage comparators |
 (USD) |
via email in
1 business day
|
ABOLISHED
|
|
| GB/T 35010.3-2018 |
Semiconductor die products—Part 3: Guide for handling, packing and storage |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 28275-2012 |
Silicon-based MEMS fabrication technology—Specification for KOH etch process |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 16465-1996 |
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 14032-1992 |
General principles of measuring methods of digital phase-locked loop for semiconductor integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 16525-1996 |
Specification of leadframes for plastic leaded chip carrier packages |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 38762.2-2020 |
Geometrical product specifications(GPS)—Dimensional tolerancing—Part 2:Dimensions other than linear or angular sizes |
 (USD) |
via email in
1-3 business day
|
TO BE VALID
|
|
| GB/T 26113-2010E |
Micro-electromechanical system technology-General rules for the assessment of micro-geometrical parameters |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 12750-1991 |
Sectional specification for semiconductor integrated circuits, excluding hybrid circuits |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 17574-1998 |
Semiconductor devices --Integrated circuits Part 2:Digital integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 17024-1997 |
Semiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ/Z 9015.1-1987 |
Semiconductor devices--Integrated circuits--Part 1: General |
 (USD) |
via email in
1-3 business day
|
ABOLISHED
|
|
| GB/T 15879-1995 |
Mechanical STANDARDization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuits |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 14112-1993 |
Semiconductor integrated circuits－Specification for stamped leadframes of plastic DIP |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
|
|
