| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| GB/T 34900-2017 |
|
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 35008-2018 |
Specification for serial NOR flash interface |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 14028-2018 |
Semiconductor integrated circuits—Measuring method of analogue switch |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 20296-2012 |
Mnemonics and symbols for integrated circuits |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 35086-2018 |
General specification for MEMS electric field sensor |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 35003-2018 |
Test methods for endurance and data retention of non-volatile memory |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 34893-2017 |
|
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 4377-2018 |
Semiconductor integrated circuits—Measuring method of voltage regulators |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 35010.1-2018 |
Semiconductor die products—Part 1:Requirements for procurement and use |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 35010.5-2018 |
Semiconductor die products—Part 5:Requirements for concerning electrical simulation |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 28276-2012 |
Silicon-based MEMS fabrication technology—Specification for dissolved wafer process |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 15878-1995 |
Specification of leadframes for small outline package |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 35010.4-2018 |
Semiconductor die products—Part 4:Requirements for die users and suppliers |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 15877-1995 |
Specification of DIP leadframes produced by etching |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB/T 15878-2015 |
Semiconductor integrated circuits—Specification of leadframes for small outline package |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 33929-2017 |
Test methods of the performance for MEMS high g accelerometer |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 16526-1996 |
The method measuring the lead-to-lead and loading capacitance of package leads |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 35009-2018 |
Specification for serial NAND flash interface |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 16523-1996 |
Specification for round quartz photomask substrates |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 33657-2017 |
Nanotechnologies—Electrical operating parameter test specification of wafer level nano-scale phase change memory cells |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
|
|
